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☆ Product Strength ☆
| Layers Count | ： |
1 - 2 Layers |
| Carbon Process | ： |
Key Switch |
| Jumper | ||
| Via Hole | ||
| Silver Process | ： |
Jumper |
| Via Hole | ||
| Peelable Mask | ||
☆ Process Capability S/S , STH ☆
| Pattem & Etch | ： | Minimum Line Width：0.008"(0.2mm) |
| Minimum Line Spacing：0.008"(0.2mm) | ||
| Solder-masking | ： | Minimum SMD/PAD Spacing：0.012"(0.3mm) |
| Punching | ： | Minimum Hole Size：0.028"(0.7mm) |
| Carbon Print | ： | Maximum Contact Resistance：150Ω |
| Maximum Resistance：50Ω/□ | ||
| Minimum Carbon Thickness：0.0005"(0.013mm) | ||
| Silver Via Hole | ： | Minimum Via Hole Pitch：0.059"(1.50mm) |
| Maximum Via Hole Resistance：100mΩ |
☆ Process Capability D/S , PTH ☆
| Board Thickness | ： | From 0.6 To 1.6 mm |
| Max Pc Size | ： | 500 x 700 mm |
| Min Hole Size | ： | 10 mil |
| Max Hole Size | ： | 256 mil (Over Use Routing) |
| Min Trace Width | ： | 3 mil |
| Min Trace Space | ： | 3 mil |
| Open-Short Test Min Space | ： | 3 mil |
| Mask Gap From Pad | ： | Min 2 mil |
| Au Plating | ： | From 1 To 30 um |
| Ni Plating | ： | From 70 To 180 um |
| Cu Plating | ： | From 25 To 250 um |
| Min Routing Space | ： | 0.8 mm |
| Min Thinkness For V-Cut | ： | 0.6 mm |
☆ Process Chart(Single Sided) ☆
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☆ Process Chart(Double Sided) ☆
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